Mochini oa ho tšoaea oa Laser o tsitsitseng oa UV Bakeng sa Botlolo
Likaroloana
1.Mohloli oa Leseli la Laser ea boleng bo phahameng, Boleng bo Phahameng ba Beam, Spot e Nyenyane e Tsepamisang maikutlo, e Ntle le e Hlakileng haholoanyane.
2.Ho Potlaka ho Tšoaea Lebelo le Bokhoni bo Phahameng.
3.Sebaka se Senyenyane se Angoang ke Mocheso, Ha ho na Phello ea Mocheso, Lisebelisoa li ke ke tsa holofala, tsa senyeha kapa tsa chesoa.
4.Wide Range of Applicable Materials, Loketseng Bakeng sa Lisebelisoa tse nang le Karabelo e kholo ea Mahlaseli a Mocheso.
5.No Consumables le Tlhokomelo, Tšebeliso e tlaase ea Matla le Ho Pholosa Litšenyehelo.
Lisebelisoa tse Tšebelisoang
Ho tšoaea hamonate ha lisebelisoa tse khethehileng ho sebelisoa haholo bakeng sa ho tšoaea le ho phekola ka holim'a likhalase tse fapaneng, likhalase tsa Lcd, masela, li-Ceramics tse tšesaane, li-Silicon Wafers tsa Semiconductor, lithollo tsa IC, Sapphire, Lifilimi tsa Polymer le Lisebelisoa tse ling.
Indasteri ea Kopo
Haholo-holo e Sebelisoa 'Marakeng o Phahameng oa Ultra-fine Processing, 3C Industry Marking, Marking of Electronic Components, Electrical Enclosures, Ho tšoaea Libotlolo tsa Packaging Bakeng sa Lijo, Meriana le Lisebelisoa tse ling tsa Polymer;Ho tlosoa ha Liaparo tsa Metal kapa tse se nang Metallic;Flexible PCB Boards, Dicing;Silicon Wafer Micro-hole le Blind Hole Processing;LCD Liquid Crystal Glass Ho tšoaea Khoutu ea mahlakore a mabeli, Ho Cheka Lesoba la Khalase, Linotlolo tsa Plastiki, Lisebelisoa tsa Elektroniki, Limpho, Thepa ea Puisano, Lisebelisoa tsa Moaho, jj.